It’s a new year and optimism comes with it! We are excited to get moving on quite a few advanced package projects and believe this is one of the future markets for our team.
We would like to share a message of resilience and hope for Aurora Circuits and the domestic PCB/advanced packaging industries from our President, Chris Kalmus.
As the year starts to slow down, we are ramping up with new, unique opportunities that test the current boundaries of “American Innovation/manufacturability”.
Well, since fall is upon us, we’ve seen an uptick in activity over the tight summer. There are still many unknowns with the economy, but we can bet that as the geopolitical tensions across the world rise to a fever pitch, supply chain concerns will continue among OEMs and manufacturers.
We are proud to announce that our MIVA LED Direct imaging system has been installed and is already paying dividends.
The last two quarters of the year will be laser focused on our capitol equipment expenditures and further shoring up/learning about the advanced packaging market. We’ve been having some great conversations with semiconductors fabs, learning about their challenges, projects and initiatives, specifically targeting areas where we can assist.