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How engineers and designers utilize different methods of heat transfer
WHAT YOU’LL LEARN:
- Advantages and uses of Heat Dissipation in the printed circuit board industry
- Advancements of this technology
- Key use cases
- How Aurora Circuits collaborates with designers and engineers across the world on this technology
DATE: Wednesday, September 30, 2020
TIME: 12:00 – 12:45 PM CDT
Dr. Chris Kalmus, Thad Bartosz, John Holquest and Brian Zirlin
This is the second in a series of free collaboration webinars covering new technologies, processes and insights from our Aurora Circuits team and partners.
Chris Kalmus, PhD
Chris is a results-driven president with over 30 years of experience growing technology and manufacturing companies whose missions focus on quality enhancement and improvement. He develops programs with positive impact on the acquisition, revenue, and retention through aggressive demand generation programs, research and development, and heightened awareness of trends in manufacturing.
President, Aismalibar North America
John Holmquest has worked at Aurora Circuits over 18 years and been involved with circuit board fabrication engineering and quality systems for over 40 years. He believes in knowing the customer’s expectations as well as the requirements in order to provide the best quality for a delivered product.
Thad Bartosz is a well-skilled industry veteran with a broad product knowledge from single-sided to multilayer product using standard and specialized materials and processes. In his tenure at Aurora, he has worked to provide customers with a cost-competitive solution to their required printed circuit specifications.
Leader of the sales, marketing, and sales enablement efforts at Aurora Circuits. Brian assists clients with numerous best practices, bridges the solution / need gap, and creates long-standing relationships based on service levels and commitment to client success.