Building the North American Advanced Packaging Ecosystem
The next generation of advanced packaging will require new developments in design, assembly, and test. Advanced substrate technology to support these advanced packages is required. There is no single package option that meets all needs, but all options have a common requirement of a laminate substrate to complete the package. Unfortunately, laminate build-up substrate capability and capacity is lacking in North America. This presentation addresses the needs for advanced substrates, the current supply situation, and the economic challenges in building the North American infrastructure.
E. Jan Vardaman
E. Jan Vardaman is President and Founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center (WTEC) study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow.