Newsletter: October 2023 | Aurora Circuits

What’s Happening at Aurora Circuits.

Well, since fall is upon us, we’ve seen an uptick in activity over the tight summer. There are still many unknowns with the economy, but we can bet that as the geopolitical tensions across the world rise to a fever pitch, supply chain concerns will continue among OEMs and manufacturers. Our work in packaging is opening new funding opportunities as we are posed to compete domestically and, by necessity in the coming years, on a global scale. The whole electronics supply chain needs a complete overhaul, not only within the manufacturing sphere, but in OEM expectations, as well. All IP, innovations and expertise has been shipped overseas for the last twenty years. OEM and semiconductor fab’s needs must be met, but an understanding of “ramp up” time is critical to allow the natural progression of reshoring technologies. We at Aurora Circuits are on this path and look forward to becoming part of the US manufacturing solution.

Thermal Impedance, Conductivity and Dissipation

Thermal impedance, thermal dissipation, and thermal conductivity are crucial concepts in the realm of heat transfer and thermal management. Each term addresses a distinct aspect of how heat is managed in various systems.

Thermal impedance represents the opposition that a material or structure offers to the flow of heat. It considers both thermal resistance and thermal capacitance, making it a comprehensive parameter for assessing how a material or component responds to changes in temperature. High thermal impedance implies that the material resists rapid temperature fluctuations.

Thermal dissipation, on the other hand, focuses on the process of releasing heat generated within a system. It involves mechanisms like conduction, convection, and radiation that enable the transfer of heat away from a heat source to the surrounding environment. Efficient thermal dissipation is crucial in preventing overheating and ensuring the longevity of electronic devices, for example.

Thermal conductivity specifically relates to a material’s ability to conduct heat. It quantifies how effectively a material can transfer heat through conduction. High thermal conductivity materials, such as metals, are excellent conductors of heat, making them suitable for applications where heat needs to be efficiently transported away, while insulators have low thermal conductivity and inhibit heat flow.

In summary, thermal impedance considers the combined effect of resistance and capacitance, thermal dissipation deals with the removal of heat, and thermal conductivity quantifies a material’s ability to conduct heat. Understanding these distinctions is essential for effective heat management in various engineering and technological applications.

7 Deadly Sins of PCB Design Manufacturability

When it comes right down to it, design flaws are built into the DNA of an end product. Ensuring that your PCBs are designed with the most effective manufacturability can not only make you more money, but it will save you time, stress, and anxiety. Unfortunately, there are tons of common misconceptions in our industry. Engineers and Designers have the right image in their head, but when it comes down to effective manufacturing, we’ve found that taking a few simple steps can save you miles of extra work! Although we strongly suggest selecting a reliable and reputable manufacturing partner, below is a list of seven deadly sins that we know can help you maximize the potential of your PCB Design from design to dock.

Deadly Sin #1
Solder mask clearance–do they really need to be that tight? It is costing them more money!

Deadly Sin #2
Line width, spaces and traces–make sure they are reviewed and optimized so you’re not paying for extra design time—faster we can get it to production, the less expensive it is for the end user.

Deadly Sin #3
Specify requirements (Incomplete specs/conflicting specs). Time is the enemy and when drawings are incomplete or notes with conflicting drawings. Shortcuts do not work and only add to back-and-forth communication and production delays.

Deadly Sin #4
Make communication protocols known between organizations–this is critical to increase the time between engineering divisions at the PCB shop and the end user.

Deadly Sin #5
Change Controls–All revisions need to be logged and referenced before production. The correct design level is critical.

Deadly Sin #6
Additional Requirements/testing after quoting–let the board shop be aware as soon as possible. This can lead to major production issues.

Deadly Sin #7
Let your board shop know what type of application the board will be used for. If there are harsh environmental elements, for example, that the circuit board will be exposed to, please inform the manufacturer’s design team so proper testing can be completed.

A lot has changed over the past 70 years, but what hasn’t changed is Aurora Circuits dedication to remaining 100% American Made. With over 70 years of knowledge and experience to make your project a reality, we stand by our commitment to manufacture the highest quality products founded on expertise and innovation

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